A New Partner, A New Chip

On the hardware side, we are very glad to introduce our latest partner Reexen. Reexen is an inference sensing and in-memory computing startup with offices in Shenzhen, Shanghai, Chengdu and Zurich. They develop ultra low-power audio and visual signal processing chips. They have already found great market success with true wireless stereo (TWS) headsets and other wearables. With high-efficiency chips, Reexen is targeting AR/VR/XR, AIoT and autonomous driving applications.  

Hongjie Liu, Reexen Co-founder & CEO

But Reexen’s strengths don’t just come from its chip technology. It also has a highly experienced international R&D team that includes scientists from Imec, ETH Zurich, Peking University, Tsinghua University and a host of other research institutions. They also have senior engineers from top semiconductor manufacturers such as Qualcomm, HiSilicon, Samsung, and Intel. So far, Reexen has over 30 patents and has published more than 20 ISSCC/JSSC papers. We look forward to relying on their extensive experience in chip design and mass production. 

You can learn more here

And you can view our video testing the world’s smallest mass-produced AI speech inference chip which was made by Reexen

A New Partner, A New Chip
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